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      Intel Corporation

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      Senior Packaging Engineer Interview

      25 May 2011
      Anonymous interview candidate
      Chandler, AZ
      No offer
      Positive experience
      Average interview

      Application

      I applied through an employee referral. The process took 4 weeks. I interviewed at Intel Corporation (Chandler, AZ) in May 2011

      Interview

      Phone Interview: Got email to schedule phone interview. In phone interview (2 interviewers), asked to walk through resume, and asked technical questions about things on resume (know everything on your resume very well). Asked behavioral questions like how to deal with conflict, when you showed leadership, etc. Guys on interview were very friendly, and also helpful later throughout the interview process. Scheduled for on-site interview 2 weeks later, but had to push back since HR didn't process fast enough. On-site interview consisted of five 30 min 1:1 interviews, one hour presentation on my dissertation research, and lunch. I was escorted by an engineer on the team throughout the day, and had lunch with him in the cafeteria. The 1:1 interviews were with managers and team leads. Presentation was in front of a bunch of engineers. 1:1 interviews involved mostly behavioral questions like how to deal with conflict, how to deal with ambiguity, when did I solve a problem, what do I do outside of work, examples of collaborating with people of different backgrounds. Also questions involved things on resume and technical questions about my graduate studies. Only technical question was about what is most important mechanical property of substrates (answer: coefficient of thermal expansion), followed by questions about how to alter the CTE. The dissertation presentation was not too difficult. Important things to note: Make sure you can fit it into an hour with questions (probably 30 minutes rehearsed), make it accessible to people who do not necessarily have the same background. People will be walking in and out of your presentation. Intel pays for airfare, 2 nights in decent hotel, 3 days rental car. They give a flat rate Visa check card to cover incidentals. All of the engineers were very nice, however managers don't tend to reply to email follow ups, but the original phone interviewers are quite responsive. I was told I would get a decision in a week, but it came in 2, not too bad.

      Interview questions [2]

      Question 1

      How do you deal with ambiguity?
      Answer question

      Question 2

      What has the lowest coefficient of thermal expansion, copper, silicon or epoxy and why?
      1 Answer
      5

      Other Senior Packaging Engineer interview reviews for Intel Corporation

      Senior Packaging Engineer Interview

      11 Feb 2019
      Anonymous interview candidate
      Chandler, AZ
      No offer
      Positive experience
      Average interview

      Application

      I applied through university. The process took 4 weeks. I interviewed at Intel Corporation (Chandler, AZ) in Dec 2018

      Interview

      I interviewed with two teams back-to-back. The first team was Materials Technology Development with whom I interviewed from 8am-2pm including 1 hr of lunch in between. There was no presentation and all the interviews which lasted from 30 minutes- 1hr were focused on my PhD research. There was one technical round in which I was asked questions related to stresses in packaging. The second team was Module engineering with whom I interviewed from 2pm - 6pm including first 1 hour of my presentation. The questions in all the interviews from this team were completely behavioral.

      Interview questions [1]

      Question 1

      How do you deal with stress? (Module Engineering)
      Answer question

      Senior Packaging Engineer Interview

      6 Nov 2015
      Anonymous interview candidate
      Chandler, AZ
      No offer
      Negative experience
      Difficult interview

      Application

      I applied online. The process took 1 day. I interviewed at Intel Corporation (Chandler, AZ) in Jul 2015

      Interview

      Onsite interview. But they never sent me an agenda. So on the interview day, I didn't even know when I would give a presentation or who would interview me or how many people I would expect to talk to. The interview started with one on one interview. (strange, isn't it?) After I interviewed with all managers and director, my host took me to another building to interview with VP. But VP didn't show up. So my host took me back and then I gave an 1 hour presentation to 3 people (my host, a manager and my HM). The manager asked me a lot of unrelated background questions. I don't work in that area. I don't know all the answers. But he kept asking even I told him I was not working in that area. HM was not even listening. Her computer had some problems that she could not even login. So she was dealing with that computer all time long till the end of my presentation. Very unprofessional! After I came back, I sent a thank you letter to everyone, but didn't hear back. After 4 weeks, I sent out a followup to HM, and didn't hear back. Another week later, I received a rejection email sent by the application system.

      Interview questions [1]

      Question 1

      What is enthalpy
      Answer question
      1

      Senior Packaging Engineer Interview

      17 Jul 2015
      Anonymous interview candidate
      Phoenix, AZ
      No offer
      Neutral experience
      Average interview

      Application

      I applied online. The process took 2 weeks. I interviewed at Intel Corporation (Phoenix, AZ) in Jun 2015

      Interview

      Phone Interview, Followed by on-site, The whole process took 2 weeks. The onsite interview included 7 interviews in total, one after the other in a very busy schedule. They also ask me to do a one hour interview about my research. The interviewers were nice and friendly but the whole thing felt rush.

      Interview questions [1]

      Question 1

      Tell me about your research
      Answer question