2 rounds of Interview either telephonic or F2F. One was technical and one was PI to understand our capabilities. After completion in same day they offered me salary.Process of one module. How it function in application and funtionally also. and undertanding of the same.Process of one module. How it function in application and funtionally also. and undertanding of the same.Process of one module. How it function in application and funtionally also. and undertanding of the same.