Is Micron Technology currently hiring?

Yes, Micron Technology is currently hiring for 77 open positions in Ireland. Use Glassdoor to find and apply for a job that loves you back. Then start preparing for your job interview at Micron Technology by browsing Glassdoor's interview experience ratings and reviews, anonymously submitted by applicants and employees.

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As of June 2026, Micron Technology employees rate their career opportunities with 3.8 out of 5 stars, according to 8,831 anonymously submitted Glassdoor reviews . This rating has increased by 1% over the last 12 months.

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Micron Technology

Micron Technology R&D Process Development Engineer jobs

77 results in Ireland

Process Technician, Advanced Packaging
Boise, ID
30d+
Films Process Development Engineer
New York, NY
US$107K - US$182K (Employer provided)
30d+
Signal Integrity Engineer - MTS
San Jose, CA
US$155K - US$340K (Employer provided)
30d+

Films Process Development Engineer
Boise, ID
US$85K - US$112K (Glassdoor Est.)
30d+
Senior Process Integration DRAM, PI Technician
Boise, ID
US$69K - US$104K (Glassdoor Est.)
30d
Sr BEOL Engineer - DRAM Process Integration
Boise, ID
US$76K - US$112K (Glassdoor Est.)
30d+
EUV Mask BEOL R&D Engineer
Boise, ID
US$65K - US$100K (Glassdoor Est.)
12d
Process Integration Engineer - DRAM, DMTS
Boise, ID
30d+
Principal Wet Process Engineer, Advanced Packaging
Boise, ID
30d+
Staff Equipment Development Engineer - Advanced Packaging
Boise, ID
30d+
Equipment Technician, Advanced Packaging
Boise, ID
US$48K - US$68K (Glassdoor Est.)
30d
New College Grad - Pathfinding Device Integration Engineer
Boise, ID
US$84K - US$129K (Glassdoor Est.)
30d+
Principal Engineer Photolithography DRAM Process Development (Evergreen)
Boise, ID
US$77K - US$110K (Glassdoor Est.)
12d
SMTS Process Engineer RDA /Metrology
Boise, ID
30d+
EUV Mask BEOL R&D Engineer
Boise, ID
US$102K - US$141K (Glassdoor Est.)
30d+
Principal Thin Films Engineer, Advanced Packaging
Boise, ID
US$86K - US$130K (Glassdoor Est.)
30d+
Process Integration Lead, APTD
Boise, ID
US$103K - US$141K (Glassdoor Est.)
30d+
Pathfinding Device Integration Engineer
Boise, ID
US$91K - US$137K (Glassdoor Est.)
30d+
High NA EUV Track - Equipment Engineer
New York, NY
US$90K - US$154K (Employer provided)
30d+
US Expansion Planning Engineer
Boise, ID
US$79K - US$104K (Glassdoor Est.)
3d
Photomask R&D Process Integration Engineer
Boise, ID
US$93K - US$131K (Glassdoor Est.)
30d+
Principal Diffusion Process Development Engineer, DRAM
Boise, ID
30d+
Process Integration Lead, APTD
Boise, ID
US$103K - US$141K (Glassdoor Est.)
30d+
Engineer-Wet Process Equipment Development
Boise, ID
US$73K - US$103K (Glassdoor Est.)
19d
Principal Process Engineer, Die Bonding
Boise, ID
US$99K - US$137K (Glassdoor Est.)
30d+
EUV Mask Technology R&D Engineer
Boise, ID
US$67K - US$108K (Glassdoor Est.)
12d
Pathfinding Device Integration Engineer
Boise, ID
US$91K - US$137K (Glassdoor Est.)
30d+
DMTS Design Engineer
San Jose, CA
US$208K - US$416K (Employer provided)
4d
Process Integration Engineer | APTD
Boise, ID
US$81K - US$109K (Glassdoor Est.)
30d+
DRAM Device & Cell Technology Engineer
Boise, ID
US$78K - US$109K (Glassdoor Est.)
11d
Foundry PDK / Collateral Integration Engineer (CAD/EDA)
Richardson, TX
US$95K - US$140K (Glassdoor Est.)
17d
Semiconductor Process Engineer - Photo
New York, NY
US$107K - US$182K (Employer provided)
30d+
Process Control Engineer (SPC)
Boise, ID
US$95K - US$131K (Glassdoor Est.)
30d+
ENGINEER-METROLOGY PROCESS
Boise, ID
US$81K - US$101K (Glassdoor Est.)
30d+
Dry Etch Process Development Engineer
Boise, ID
US$80K - US$105K (Glassdoor Est.)
30d+
Staff Engineer, APTD Backgrind/Edge Trim
Boise, ID
30d+
R&D Thin Films Process Development Engineer Advanced DRAM
Boise, ID
US$81K - US$104K (Glassdoor Est.)
30d+
Process Integration Engineer | APTD
Boise, ID
US$81K - US$109K (Glassdoor Est.)
30d+
Advanced DRAM Process Integration Engineer
Boise, ID
US$91K - US$123K (Glassdoor Est.)
30d+
AI Strategy, Emerging Systems & AI Principal Architect
Boise, ID
30d+

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