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      Broadcom

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      IC Packaging Engineer Interview

      1 Aug 2018
      Anonymous interview candidate
      Irvine, CA
      No offer
      Positive experience
      Average interview

      Application

      I applied online. The process took 1 day. I interviewed at Broadcom (Irvine, CA) in May 2018

      Interview

      Submit the application online. Receive phone interview from manager in a week. Onsite interview after 2 weeks. 5 engineers and 1 manager are involved. Each 1 on 1 session lasts 45 min. Questions are based on past experience and general questions on electronic packaging.

      Interview questions [1]

      Question 1

      Why individual chip needs to be packaged?
      1 Answer
      1

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